Solder Bump

LANGUAGE : JAPANESE

SEC's Advanced Technology Harmonized with Global Environment

SEC offers eco-friendly and lead-free solder bump.

Solder Bump
Solder Bump
Solder Bump Processing Business
What SEC Must Carry Out
The importance of solder bonding is increasing, as higher performance electronic devices are required.
We offer eco-friendly and lead-free solder bump.
We will continue to work hard for environmental conservation and for technology innovation.
Solder Bump
Business Flow
Our technical experts carefully guide all customers and provide them with quick feedback.
We also provide performance-testing service for our customers.
Business Flow
Design rule
The Standard Specification of
Solder Bump
SEC achieves high-precision and fine-pitch gold bump with electroplating.
SEC accepts 8 inch (standard size) wafer.
Please consult with us about different wafer size.
Solder Bump Process Flow
solder-bumpExample:
Solder Bump Appearance
solder-bump
Design rule
The Standard Specification of
Cu Post Solder Bump
SEC achieves high-precision and fine-pitch gold bump with electroplating.
SEC accepts 8 inch (standard size) wafer.
Please consult with us about different wafer size.
Cu Post Solder Bump Process Flow
cu-postExample: Cu Post
Solder Bump Appearance
cu-post
Design rule
EndLine


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