Applied Technology

LANGUAGE : JAPANESE

Application, Creation and Realization

With its superior bumping process technology,we will develop products that satisfy customers' needs.

Applied Technology
Applied Technology
Applied Technology
We offer gold bumping process, solder bumping process, Cu bumping process, Cu rewiring process and UBM forming process.
We are specialized specifically for 6 to 8 inches wafer but we can customize the size and the thickness of all types of bump.

Applied technology appearance example

Cu Bump

Cu Bump
Cu Bump
Cu Bump

Plated Printed Wiring(Cu Wiring)

Cu Wiring
Cu Wiring
Cu Wiring
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